JEDEC JESD51-1

Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T15:13:14Z
date available	2017-09-04T15:13:14Z
date copyright	35034
date issued	1995
identifier other	LZSUCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/11911
description abstract	The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be used to determine the thermal characteristics of single integrated circuit devices housed in some form of electrical package. This method will provide a basis for comparison of different devices housed in the same electronic package or similar devices housed in different electronic packages.
language	English
title	JEDEC JESD51-1	num
title	Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)	en
type	standard
page	36
status	Active
tree	JEDEC - Solid State Technology Association:;1995
contenttype	fulltext
subject keywords	Integrated Circuit Thermal Measurement
subject keywords	Single Semiconductor Device
subject keywords	Test Method - Electrical
subject keywords	Thermal Measurement - Integrated Circuit