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JEDEC JESD51-1
Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
Organization:
JEDEC - Solid State Technology Association
Year: 1995
Abstract: The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be used to determine the thermal characteristics of single integrated circuit devices housed in some form of electrical package. This method will provide a basis for comparison of different devices housed in the same electronic package or similar devices housed in different electronic packages.
Subject: Integrated Circuit Thermal Measurement
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:13:14Z | |
| date available | 2017-09-04T15:13:14Z | |
| date copyright | 35034 | |
| date issued | 1995 | |
| identifier other | LZSUCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/11911 | |
| description abstract | The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be used to determine the thermal characteristics of single integrated circuit devices housed in some form of electrical package. This method will provide a basis for comparison of different devices housed in the same electronic package or similar devices housed in different electronic packages. | |
| language | English | |
| title | JEDEC JESD51-1 | num |
| title | Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device) | en |
| type | standard | |
| page | 36 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;1995 | |
| contenttype | fulltext | |
| subject keywords | Integrated Circuit Thermal Measurement | |
| subject keywords | Single Semiconductor Device | |
| subject keywords | Test Method - Electrical | |
| subject keywords | Thermal Measurement - Integrated Circuit |