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JEDEC JESD51-10
Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
Organization:
JEDEC - Solid State Technology Association
Year: 2000
Abstract: This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-10 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.
Subject: DIP
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JEDEC JESD51-10
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T17:39:41Z | |
| date available | 2017-09-04T17:39:41Z | |
| date copyright | 07/01/2000 | |
| date issued | 2000 | |
| identifier other | DTJZMAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/162705 | |
| description abstract | This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-10 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families. | |
| language | English | |
| title | JEDEC JESD51-10 | num |
| title | Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements | en |
| type | standard | |
| page | 18 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2000 | |
| contenttype | fulltext | |
| subject keywords | DIP | |
| subject keywords | Thermal Measurements | |
| subject keywords | Through-Hole Packages |