JEDEC JESD51-50

Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs)

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T17:42:19Z
date available	2017-09-04T17:42:19Z
date copyright	04/01/2012
date issued	2012
identifier other	EAJWUEAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/165344
description abstract	The measurement methodology described herein is distributed among several documents so that the appropriate combination of documents can be selected to meet specific thermal measurement requirements. This document provides the OVERVIEW; Each group will have one or more applicable documents to reflect different thermal measurement requirements. Because environmental conditions, component mounting approaches and device construction techniques and processes will change as technology changes, additional documents will be added to these groups as the needs arise and standards established. As appropriate, each of these documents will contain terminology and symbolic definitions that are specific to the material covered by the individual document; this information will also be included in a single document to make for easy access.
language	English
title	JEDEC JESD51-50	num
title	Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs)	en
type	standard
page	12
status	Active
tree	JEDEC - Solid State Technology Association:;2012
contenttype	fulltext