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JEDEC JESD51-50
Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs)
Organization:
JEDEC - Solid State Technology Association
Year: 2012
Abstract: The measurement methodology described herein is distributed among several documents so that the appropriate combination of documents can be selected to meet specific thermal measurement requirements. This document provides the OVERVIEW;
Each group will have one or more applicable documents to reflect different thermal measurement requirements. Because environmental conditions, component mounting approaches and device construction techniques and processes will change as technology changes, additional documents will be added to these groups as the needs arise and standards established. As appropriate, each of these documents will contain terminology and symbolic definitions that are specific to the material covered by the individual document; this information will also be included in a single document to make for easy access.
Each group will have one or more applicable documents to reflect different thermal measurement requirements. Because environmental conditions, component mounting approaches and device construction techniques and processes will change as technology changes, additional documents will be added to these groups as the needs arise and standards established. As appropriate, each of these documents will contain terminology and symbolic definitions that are specific to the material covered by the individual document; this information will also be included in a single document to make for easy access.
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JEDEC JESD51-50
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T17:42:19Z | |
| date available | 2017-09-04T17:42:19Z | |
| date copyright | 04/01/2012 | |
| date issued | 2012 | |
| identifier other | EAJWUEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/165344 | |
| description abstract | The measurement methodology described herein is distributed among several documents so that the appropriate combination of documents can be selected to meet specific thermal measurement requirements. This document provides the OVERVIEW; Each group will have one or more applicable documents to reflect different thermal measurement requirements. Because environmental conditions, component mounting approaches and device construction techniques and processes will change as technology changes, additional documents will be added to these groups as the needs arise and standards established. As appropriate, each of these documents will contain terminology and symbolic definitions that are specific to the material covered by the individual document; this information will also be included in a single document to make for easy access. | |
| language | English | |
| title | JEDEC JESD51-50 | num |
| title | Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs) | en |
| type | standard | |
| page | 12 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2012 | |
| contenttype | fulltext |