JEDEC JESD22-B110B

Mechanical Shock – Component and Subassembly

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T15:26:45Z
date available	2017-09-04T15:26:45Z
date copyright	07/01/2013
date issued	2013
identifier other	NPILFFAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/27589
description abstract	Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of components and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test components in usage conditions as assembled to printed wiring boards. Mechanical Shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for component qualification.
language	English
title	JEDEC JESD22-B110B	num
title	Mechanical Shock – Component and Subassembly	en
type	standard
page	14
status	Active
tree	JEDEC - Solid State Technology Association:;2013
contenttype	fulltext