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JEDEC JESD22-B110B
Mechanical Shock – Component and Subassembly
Organization:
JEDEC - Solid State Technology Association
Year: 2013
Abstract: Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of components and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test components in usage conditions as assembled to printed wiring boards. Mechanical Shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for component qualification.
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JEDEC JESD22-B110B
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:26:45Z | |
| date available | 2017-09-04T15:26:45Z | |
| date copyright | 07/01/2013 | |
| date issued | 2013 | |
| identifier other | NPILFFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/27589 | |
| description abstract | Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of components and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test components in usage conditions as assembled to printed wiring boards. Mechanical Shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for component qualification. | |
| language | English | |
| title | JEDEC JESD22-B110B | num |
| title | Mechanical Shock – Component and Subassembly | en |
| type | standard | |
| page | 14 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2013 | |
| contenttype | fulltext |