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JEDEC JESD33B
Standard Method for Measuring and Using the Temperature Coefficient of Resistance to Determine the Temperature of a Metallization Line
Organization:
JEDEC - Solid State Technology Association
Year: 2004
Abstract: This newly revised test method provides a procedure for measuring the temperature coefficient of resistance, TCR(T), of thin-film metallizations used in microelectronic circuits and devices. Procedures are also provided to use the TCR(T) to determine the temperature of a metallization line under Joule-heating conditions and to determine the ambient temperature where the metallization line is used as a temperature sensor. Originally, the method was intended only for aluminum-based metallizations and for other metallizations that satisfy the linear dependence and stability stipulations of the method. The method has been revised to make it explicitly applicable to copper-based metallizations, as well, and at temperatures beyond where the resistivity of copper is no longer linearly dependent on temperature (beyond approximately 200 °C). Using the TCR(T) measured for copper in the linear-dependent region, a factor is used to correct the calculated temperature at these higher temperatures
Subject: Measurement - Temperature Coefficient
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:27:44Z | |
| date available | 2017-09-04T15:27:44Z | |
| date copyright | 02/01/2004 | |
| date issued | 2004 | |
| identifier other | NSGYEBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/28699 | |
| description abstract | This newly revised test method provides a procedure for measuring the temperature coefficient of resistance, TCR(T), of thin-film metallizations used in microelectronic circuits and devices. Procedures are also provided to use the TCR(T) to determine the temperature of a metallization line under Joule-heating conditions and to determine the ambient temperature where the metallization line is used as a temperature sensor. Originally, the method was intended only for aluminum-based metallizations and for other metallizations that satisfy the linear dependence and stability stipulations of the method. The method has been revised to make it explicitly applicable to copper-based metallizations, as well, and at temperatures beyond where the resistivity of copper is no longer linearly dependent on temperature (beyond approximately 200 °C). Using the TCR(T) measured for copper in the linear-dependent region, a factor is used to correct the calculated temperature at these higher temperatures | |
| language | English | |
| title | JEDEC JESD33B | num |
| title | Standard Method for Measuring and Using the Temperature Coefficient of Resistance to Determine the Temperature of a Metallization Line | en |
| type | standard | |
| page | 40 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2004 | |
| contenttype | fulltext | |
| subject keywords | Measurement - Temperature Coefficient | |
| subject keywords | Metallization Lines | |
| subject keywords | Temperature Coefficient - Resistance |