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Method for Characterizing the Electromigration Failure Time Distribution of Interconnects Under Constant-Current and Temperature Stress

contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T15:29:36Z
date available2017-09-04T15:29:36Z
date copyright03/01/2006
date issued2006
identifier otherNYEZIBAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/30909
description abstractThis is an accelerated stress test method for determining sample estimates and their confidence limits of the median-time-to-failure, sigma, and early percentile of a log-Normal distribution, which are used to characterize the electromigration failure-time distribution of equivalent metal lines subjected to a constant current-density and temperature stress. Failure is defined as some pre-selected fractional increase in the resistance of the line under test. Analysis procedures are provided to analyze complete and singly, right-censored failure-time data. Sample calculations for complete and right-censored data are provided in Annex A. The analyses are not intended for the case when the failure distribution cannot be characterized by a single log-Normal distribution.
languageEnglish
titleJEDEC JESD202num
titleMethod for Characterizing the Electromigration Failure Time Distribution of Interconnects Under Constant-Current and Temperature Stressen
typestandard
page38
statusActive
treeJEDEC - Solid State Technology Association:;2006
contenttypefulltext
subject keywordsAccelerated Stress Test
subject keywordsAnalysis fo Censored Data
subject keywordsElectromigration
subject keywordsInterconnect Reliability
subject keywordsTest Method
subject keywordsTime to Failure


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