JEDEC JESD202
Method for Characterizing the Electromigration Failure Time Distribution of Interconnects Under Constant-Current and Temperature Stress
Organization:
JEDEC - Solid State Technology Association
Year: 2006
Abstract: This is an accelerated stress test method for determining sample estimates and their confidence limits of the median-time-to-failure, sigma, and early percentile of a log-Normal distribution, which are used to characterize the electromigration failure-time distribution of equivalent metal lines subjected to a constant current-density and temperature stress. Failure is defined as some pre-selected fractional increase in the resistance of the line under test. Analysis procedures are provided to analyze complete and singly, right-censored failure-time data. Sample calculations for complete and right-censored data are provided in Annex A. The analyses are not intended for the case when the failure distribution cannot be characterized by a single log-Normal distribution.
Subject: Accelerated Stress Test
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contributor author | JEDEC - Solid State Technology Association | |
date accessioned | 2017-09-04T15:29:36Z | |
date available | 2017-09-04T15:29:36Z | |
date copyright | 03/01/2006 | |
date issued | 2006 | |
identifier other | NYEZIBAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/30909 | |
description abstract | This is an accelerated stress test method for determining sample estimates and their confidence limits of the median-time-to-failure, sigma, and early percentile of a log-Normal distribution, which are used to characterize the electromigration failure-time distribution of equivalent metal lines subjected to a constant current-density and temperature stress. Failure is defined as some pre-selected fractional increase in the resistance of the line under test. Analysis procedures are provided to analyze complete and singly, right-censored failure-time data. Sample calculations for complete and right-censored data are provided in Annex A. The analyses are not intended for the case when the failure distribution cannot be characterized by a single log-Normal distribution. | |
language | English | |
title | JEDEC JESD202 | num |
title | Method for Characterizing the Electromigration Failure Time Distribution of Interconnects Under Constant-Current and Temperature Stress | en |
type | standard | |
page | 38 | |
status | Active | |
tree | JEDEC - Solid State Technology Association:;2006 | |
contenttype | fulltext | |
subject keywords | Accelerated Stress Test | |
subject keywords | Analysis fo Censored Data | |
subject keywords | Electromigration | |
subject keywords | Interconnect Reliability | |
subject keywords | Test Method | |
subject keywords | Time to Failure |