JEDEC JEP170

Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T16:05:44Z
date available	2017-09-04T16:05:44Z
date copyright	01/01/2013
date issued	2013
identifier other	RWRQBFAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/68937
description abstract	This publ impact en considere products. or visual n in actual p lication prov nd-user produ d visual nonc Finally, it w nonconformit product drawi ides descript cts and/or app conformities s ill depict a m ties and guida ings and spec tion of defec plications. It since they sho method for visu ance for dispo cifications. ts observed will also prov ould be less d ual inspection osition. Offic in FCxGA c vide illustrati disruptive of q n that can be u cial criteria fo components t ion on other d quality or reli utilized to ide or product acc that can adve defects that m ability to cus entify these d ceptance shou ersely may be tomer defects uld be
language	English
title	JEDEC JEP170	num
title	Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)	en
type	standard
page	18
status	Active
tree	JEDEC - Solid State Technology Association:;2013
contenttype	fulltext