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JEDEC JESD22-B116A
Wire Bond Shear Test Method
Organization:
JEDEC - Solid State Technology Association
Year: 2009
Abstract: This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.
Subject: Ball Bond
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JEDEC JESD22-B116A
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T16:17:22Z | |
| date available | 2017-09-04T16:17:22Z | |
| date copyright | 08/01/2009 | |
| date issued | 2009 | |
| identifier other | BLECOCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/80713 | |
| description abstract | This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance. | |
| language | English | |
| title | JEDEC JESD22-B116A | num |
| title | Wire Bond Shear Test Method | en |
| type | standard | |
| page | 18 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2009 | |
| contenttype | fulltext | |
| subject keywords | Ball Bond | |
| subject keywords | Test Method - Wire Bond Shear | |
| subject keywords | Wire Bond Shear |