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JEDEC JEP140
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
Organization:
JEDEC - Solid State Technology Association
Year: 2006
Abstract: The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.
Subject: Beaded
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T16:32:56Z | |
| date available | 2017-09-04T16:32:56Z | |
| date copyright | 06/01/2002 (R 2006) | |
| date issued | 2006 | |
| identifier other | USWSJBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/96375 | |
| description abstract | The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards. | |
| language | English | |
| title | JEDEC JEP140 | num |
| title | Beaded Thermocouple Temperature Measurement of Semiconductor Packages | en |
| type | standard | |
| page | 14 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2006 | |
| contenttype | fulltext | |
| subject keywords | Beaded | |
| subject keywords | Component Assembly | |
| subject keywords | Solder Reflow Operations | |
| subject keywords | Temperature Measurement | |
| subject keywords | Thermocouple |