درباره ما
ECIA - Electronic Components Industry Association: Recent submissions
Now showing items 261-280 of 507
-
ECA 416
Abstract: This Standard covers the general requirements for current-carrying filters, alternating-current (ac) and direct-current (dc), for use primarily in the reduction of broadband radio interference.
Portions of latest ... -
ECA 359-A
Abstract: The colors defined in this standard are intended to be applied to the marking of electronic components such as resistors, capacitors, and wires in a manner described in the EIA Standards for these components. In addition, ... -
ECA EIA-540BAAA-A
Abstract: The pin grid array (PGA) sockets of assessed quality covered by this detail specification have:
— Maximum enclosure dimensions as shown in figure 1.
— A working voltage not exceeding 250 volts (rms). ... -
ECA 534
Abstract: BACKGROUND AND PURPOSE
Leaded Electronic Component parts are subjected to a wide variety of internal stresses during the soldering of their terminations by solder dips, soldering irons, or automatic wave soldering ... -
ECA EIA/RS-270
Abstract: This standard establishes minimum requirements for the following :
Application of devices to wire.
User certification of tools used for application noted in 2.1. This standard in no way establishes test methods or ... -
ECA EIA-364-93
Abstract: Object
The object of this test procedure is to assess the ability of a reusable insulation displacement termination to withstand a specified number of connections and disconnections. -
ECA EIA-700A0AF
Abstract: This standard applies to a family of connectors having the following characteristics:
C shielded,
C 68 position
C trapezoidal-shaped mating interface,
C 0.8 mm pitch spacing of contacts on a double row, ... -
ECA PDP-100
Abstract: INTRODUCTION
This section is a guide to manufacturers of passive electronic products for the preparation and submission of outline drawings of packages (here-in-after referred to as outlines) for outline ... -
ECA IS-48
Abstract: This standard covers industrial grade RF coils which are intended as simple inductive elements in RF circuits. They are primarily intended for machine packaging, insertion and soldering on printed wiring boards.
NOTE: ... -
ECA EIA-364-95
Abstract: This document defines methods to evaluate the coupled condition of a connector plug, with its mating receptacle. This procedure assesses the ability of a connector pair to remain fully mated after exposure to test conditions ... -
ECA TEP 170
Abstract: This test method applies to the measurement of x-radiation emitted from microwave tubes.
Purpose To obtain the x-radiation characteristics of microwave tubes in order to determine the levels emitted by the tubes when ... -
ECA EIA-815
Abstract: Description
This specification defines the qualification program for miniature aluminum electrolytic capacitors with leads. The qualification program is defined in table 1. Specification sheets can be ... -
ECA CB 5
Abstract: This test procedure provides standard methods for the evaluation of semiconductor thermal dissipators.
Purpose:
The purpose of this Bulletin is to establish standard procedures for the evaluation, calibration, ... -
ECA EIA-364-1005
Abstract: This standard describes recommended test sequences to determine the susceptibility of contacts to fretting corrosion that is a major and significant failure mechanism that can be caused by vibration and thermal cycling. -
ECA EIA-198-1-F
Abstract: EIA-198-1-F of this standard provides means to characterize ceramic capacitors electrically and mechanically by use of type designators. In addition, this section outlines dielectric classifications, marking specifications ... -
ECA TEP 189
Abstract: INTRODUCTION
Radioactive isotopes are, on occasion, intentionally added by manufacturers of electron tubes to improve tube performance. For this reason, manufacturs may be required t o determine the total ... -
ECA 251-A
Abstract: This test method covers a procedure for comparatively determining the effects of printed conductor materials, conductor cross sections, substrate materials, and processes on the temperature -D.C. current characteristics ... -
ECA EIA-540FAAA
Abstract: The Muiti-Package Moduie Sockets of assessed & quality covered by this Detail Specification shall have:
a) Maximum enclosure dimensions (See Figure 1.)
b) Working vottage not to exceed 250 votts (mis).
c) Current ... -
ECA IS-701
Abstract: This specification defines a qualification test sequence for production ball grid array (BGA) socket assemblies. -
ECA 339
Abstract: This method measures the susceptibility of magnetic tape to layer-to-layer adhesion between adjacent layers of a tape roll. This Standard was prepared because no other comparable industry- accepted document relating ...