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ECIA - Electronic Components Industry Association: Recent submissions
Now showing items 241-260 of 507
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ECA EIA/ECA-961
Abstract: Description
This specification defines the qualification program for Integrated Passive Devices (IPD) with die level solder bump interconnects. The qualification program is defined in Table 1. Specification ... -
ECA IS-43AF
Abstract: This Detail Specification defines Type 2 Plenum cable used with the Token Ring LAN Cabling System. Type 2 P consists of 2 twisted pairs of Data Grade Media (DGM) shielded with aluminum tape and braided shields, all cabled ... -
ECA TEP140
Abstract: INTRODUCTION
These procedures were formulated by JEDEC Committee JT-16 on Government Liason and approved by the JEDEC Electron Tube Council. It is a revision of the 1963 publication which first expressed ... -
ECA RS-385
Abstract: This standard establishes six series of numbers which may be used as preferred values in the design of electronic components, equipment or systems. -
ECA EIA-364-68A
Abstract: This standard establishes a test method to determine the strength of the actuating mechanism of a connector release mechanism. The actuating mechanism test may be conducted as one of the tests in a sequential test plan, ... -
ECA EIA-364-03C
Abstract: This standard establishes a test method to determine the ability of the connector-to-wire and interface area seals of a mated connector assembly to perform satisfactorily during and subsequent to simulated rapid descents ... -
ECA IS-84
Abstract: This standard is applicable to modular two-part connectors particularly designed for use with printed boards in equipment for telecommunications requirements in electronic devices employing similar techniques. The group ... -
ECA EIA-966
Abstract: This specification defines the mechanical and connector contact performance requirements for a composite connector system. This composite system is designed to support high speed serial signals and power on different ... -
ECA EIA-364-43C
Abstract: This standard establishes a test method to determine the ability of connectors to withstand stress resulting from loads applied to rear accessory hardware such as might be experienced with cables hanging from plugs mated ... -
ECA 493
Abstract: This procedure is recommended for the conversion of U.S. to metric dimensions in the preparation of drawings, specifications, and published data for color and monochrome television picture tubes and their component parts. ... -
ECA CB 5-1
Abstract: The scope of this supplement to EIA Components Bulletin No. 5 is to present methods of instrumentation for plastic case semiconductors and integrated circuits for evaluation of thermal dissipating devices. -
ECA EIA-540FAAB
Abstract: The Multi-Package Module Sockets of aswssed quality covered by this Detail Specification shall have:
a) Maximum enclosure dimensions (See Figure 1.)
b) Working voltage not to exceed 250 volts (mis).
c) Current ... -
ECA EIA-364-79
Abstract: Application of this insert bond evaluation procedure is limited to qualification of periodic inspection testing and generally is a test group of its own. This standard provides a technique for evaluating the strength of a ... -
ECA 724
Abstract: This document defines a Product Life Cycle curve model for use by the electronics industry to standardize the terms and definitions used to describe the life cycle status of a product.. When required by the customer, a ... -
ECA 186-E
Abstract: This Standard establishes uniform methods for testing electronic component parts. In case of conflict between this Standard and any individual component standards or detail specifications, the requirements of the individual ... -
ECA EIA-773
Abstract: Scope and purpose
This document is intended to aid in the development and/or revision of EIA standards. This is not meant to be an all inclusive document and can be subject to reconsideration. -
ECA ECA-364-56E
Abstract: This standard establishes a test method for determining if connectors or sockets can withstand exposure to soldering conditions either by soldering iron, solder dip, solder wave, or reflow soldering techniques.
Object ... -
ECA EIA-421-A
Abstract: This Standard applies to dry reed switches, magnetically actuated, with hermetically sealed contacts. The Standard provides the procedure to be used for inspecting, testing and rating various switch types as defined in the ...