ECA EIA-540GAAA

Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment - Stabilized: May 2013

contributor author	ECIA - Electronic Components Industry Association
date accessioned	2017-09-04T15:37:23Z
date available	2017-09-04T15:37:23Z
date copyright	10/01/1993 (R 2001)(S 2013)
date issued	2013
identifier other	AYZPCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=anid=47037D83081DAC4218546D6E273C9FCD/handle/yse/39290
description abstract	The Burn-In Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1. b) A working voltage not exceeding 125 volts (rms) c) Current not exceeding 1 ampere per pin OBJECT The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspect ion purposes.
language	English
title	ECA EIA-540GAAA	num
title	Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment - Stabilized: May 2013	en
type	standard
page	20
status	Active
tree	ECIA - Electronic Components Industry Association:;2013
contenttype	fulltext