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ECA EIA-540GAAA
Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment - Stabilized: May 2013
Organization:
ECIA - Electronic Components Industry Association
Year: 2013
Abstract: The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1.
b) A working voltage not exceeding 125 volts (rms)
c) Current not exceeding 1 ampere per pin
OBJECT
The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspect ion purposes.
a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1.
b) A working voltage not exceeding 125 volts (rms)
c) Current not exceeding 1 ampere per pin
OBJECT
The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspect ion purposes.
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ECA EIA-540GAAA
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T15:37:23Z | |
| date available | 2017-09-04T15:37:23Z | |
| date copyright | 10/01/1993 (R 2001)(S 2013) | |
| date issued | 2013 | |
| identifier other | AYZPCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=anid=47037D83081DAC4218546D6E273C9FCD/handle/yse/39290 | |
| description abstract | The Burn-In Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1. b) A working voltage not exceeding 125 volts (rms) c) Current not exceeding 1 ampere per pin OBJECT The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspect ion purposes. | |
| language | English | |
| title | ECA EIA-540GAAA | num |
| title | Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment - Stabilized: May 2013 | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2013 | |
| contenttype | fulltext |