درباره ما
ECA EIA/ECA-576-A
Resistors, Rectangular, Surface Mount Precision
Organization:
ECIA - Electronic Components Industry Association
Year: 2005
Abstract: This standard covers thin film precision rectangular leadless discrete fixed resistors with temperature coefficients of + 50 PPM/"C and lower and resistance tolerances of 1%, OS%, 0.25%, 0.1% and 0.05% for use in surface mounting applications using soldering techniques.
Typical Construction Characteristics
The termination shall include a leach-resistant barrier layer, made of nickel or an equivalent material. The barrier layer shall be covered with a layer of solderable material.
Typical Construction Characteristics
The termination shall include a leach-resistant barrier layer, made of nickel or an equivalent material. The barrier layer shall be covered with a layer of solderable material.
Collections
:
-
Statistics
ECA EIA/ECA-576-A
Show full item record
| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:23:24Z | |
| date available | 2017-09-04T16:23:24Z | |
| date copyright | 09/01/2005 | |
| date issued | 2005 | |
| identifier other | TSNMIBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho1626AF679D40527318549F1EFDEC014A/handle/yse/86728 | |
| description abstract | This standard covers thin film precision rectangular leadless discrete fixed resistors with temperature coefficients of + 50 PPM/"C and lower and resistance tolerances of 1%, OS%, 0.25%, 0.1% and 0.05% for use in surface mounting applications using soldering techniques. Typical Construction Characteristics The termination shall include a leach-resistant barrier layer, made of nickel or an equivalent material. The barrier layer shall be covered with a layer of solderable material. | |
| language | English | |
| title | ECA EIA/ECA-576-A | num |
| title | Resistors, Rectangular, Surface Mount Precision | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2005 | |
| contenttype | fulltext |