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MIL-T-81955
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
Organization:
NAVY - OS - Naval Surface Warfare Center (NSWCIHEODTD)
Year: 1973
Abstract: This specification covers the requirements for tin plating deposited by immersion, without an external potential, on copper and copper alloys.
Deposited tin plating shall be of the following classes as specified (see 6.2):
Class 1 - 0.000076 to 0.0001 inch thick
Class 2 - 0.000051 to 0.000075 inch thick
Class 3 - 0.000026 to 0.000050 inch thick
Class 4 - 0.000025 inch or less thick Intended Use: The tin plating covered in this specification is intended for use as a base for soldering printed circuitry and microwave parts and components. The thin plating, ranging up to 100 millionths of an inch (2.54 µm) in thickness offers some corrosion protection but should not be used as a substitute for tin plating, electro deposited or hot dipped, in accordance with MIL-T-10727. The tin plating should not be used on parts which in service reach a temperature of 330°F (166°C) or higher or come in contact with other parts which reach those temperatures.
Deposited tin plating shall be of the following classes as specified (see 6.2):
Class 1 - 0.000076 to 0.0001 inch thick
Class 2 - 0.000051 to 0.000075 inch thick
Class 3 - 0.000026 to 0.000050 inch thick
Class 4 - 0.000025 inch or less thick Intended Use: The tin plating covered in this specification is intended for use as a base for soldering printed circuitry and microwave parts and components. The thin plating, ranging up to 100 millionths of an inch (2.54 µm) in thickness offers some corrosion protection but should not be used as a substitute for tin plating, electro deposited or hot dipped, in accordance with MIL-T-10727. The tin plating should not be used on parts which in service reach a temperature of 330°F (166°C) or higher or come in contact with other parts which reach those temperatures.
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| contributor author | NAVY - OS - Naval Surface Warfare Center (NSWCIHEODTD) | |
| date accessioned | 2017-09-04T17:23:11Z | |
| date available | 2017-09-04T17:23:11Z | |
| date copyright | 26983 | |
| date issued | 1973 | |
| identifier other | ZYGPDAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho162sear3FCDC52731854DD6EFDEC014A/handle/yse/146394 | |
| description abstract | This specification covers the requirements for tin plating deposited by immersion, without an external potential, on copper and copper alloys. Deposited tin plating shall be of the following classes as specified (see 6.2): Class 1 - 0.000076 to 0.0001 inch thick Class 2 - 0.000051 to 0.000075 inch thick Class 3 - 0.000026 to 0.000050 inch thick Class 4 - 0.000025 inch or less thick Intended Use: The tin plating covered in this specification is intended for use as a base for soldering printed circuitry and microwave parts and components. The thin plating, ranging up to 100 millionths of an inch (2.54 µm) in thickness offers some corrosion protection but should not be used as a substitute for tin plating, electro deposited or hot dipped, in accordance with MIL-T-10727. The tin plating should not be used on parts which in service reach a temperature of 330°F (166°C) or higher or come in contact with other parts which reach those temperatures. | |
| language | English | |
| title | MIL-T-81955 | num |
| title | TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS | en |
| type | standard | |
| page | 9 | |
| status | Active | |
| tree | NAVY - OS - Naval Surface Warfare Center (NSWCIHEODTD):;1973 | |
| contenttype | fulltext |