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IPC TM-650 2.3.40
Thermal Stability
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This test method establishes a procedure for determining the thermal decomposition temperature of organic films using thermogravimetric analysis (TGA).
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IPC TM-650 2.3.40
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:38:02Z | |
| date available | 2017-09-04T16:38:02Z | |
| date copyright | 07/01/1995 | |
| date issued | 1995 | |
| identifier other | VHFLCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/101595 | |
| description abstract | This test method establishes a procedure for determining the thermal decomposition temperature of organic films using thermogravimetric analysis (TGA). | |
| language | English | |
| title | IPC TM-650 2.3.40 | num |
| title | Thermal Stability | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |