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IPC CF-152B
Composite Metallic Material Specification for Printed Wiring Board
Organization:
IPC - Association Connecting Electronics Industries
Year: 1997
Abstract: This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper bonded to each side of molybdenum.
Purpose
This specification addresses the requirements for procurement of copper/invar/copper and copper/molybdenum/copper for use in electronic applications.
Purpose
This specification addresses the requirements for procurement of copper/invar/copper and copper/molybdenum/copper for use in electronic applications.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:41:34Z | |
| date available | 2017-09-04T16:41:34Z | |
| date copyright | 35765 | |
| date issued | 1997 | |
| identifier other | VPNEDAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/104887 | |
| description abstract | This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper bonded to each side of molybdenum. Purpose This specification addresses the requirements for procurement of copper/invar/copper and copper/molybdenum/copper for use in electronic applications. | |
| language | English | |
| title | IPC CF-152B | num |
| title | Composite Metallic Material Specification for Printed Wiring Board | en |
| type | standard | |
| page | 33 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |