IPC 2221B

Abstract

This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered. <br><strong>Purpose</strong> <br>The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific interconnecting structure sectional standard (see 1.2) to produce detailed designs intended to mount and connect components. This standard is not intended for use as a performance specification for finished printed boards nor as an acceptance document for electronic assemblies.