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IPC 2221B
Generic Standard on Printed Board Design
Organization:
IPC - Association Connecting Electronics Industries
Year: 2012
Abstract: This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered.
Purpose
The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific interconnecting structure sectional standard (see 1.2) to produce detailed designs intended to mount and connect components. This standard is not intended for use as a performance specification for finished printed boards nor as an acceptance document for electronic assemblies.
Purpose
The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific interconnecting structure sectional standard (see 1.2) to produce detailed designs intended to mount and connect components. This standard is not intended for use as a performance specification for finished printed boards nor as an acceptance document for electronic assemblies.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:42:14Z | |
| date available | 2017-09-04T16:42:14Z | |
| date copyright | 41214 | |
| date issued | 2012 | |
| identifier other | VRGZAFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/105544 | |
| description abstract | This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered. Purpose The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific interconnecting structure sectional standard (see 1.2) to produce detailed designs intended to mount and connect components. This standard is not intended for use as a performance specification for finished printed boards nor as an acceptance document for electronic assemblies. | |
| language | English | |
| title | IPC 2221B | num |
| title | Generic Standard on Printed Board Design | en |
| type | standard | |
| page | 184 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2012 | |
| contenttype | fulltext |