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IPC TM-650 2.2.12.3
Weight and Thickness Determination of Copper Foils with Etchable Carriers
Organization:
IPC - Association Connecting Electronics Industries
Year: 1989
Abstract: This method of test covers the procedure for determining the weights and/or thickness of etchable carrier copper foils for printed circuits.
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IPC TM-650 2.2.12.3
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:48:20Z | |
| date available | 2017-09-04T16:48:20Z | |
| date copyright | 07/01/1989 | |
| date issued | 1989 | |
| identifier other | WHSHCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/111718 | |
| description abstract | This method of test covers the procedure for determining the weights and/or thickness of etchable carrier copper foils for printed circuits. | |
| language | English | |
| title | IPC TM-650 2.2.12.3 | num |
| title | Weight and Thickness Determination of Copper Foils with Etchable Carriers | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1989 | |
| contenttype | fulltext |