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IPC 4103A
Specification for Base Materials for High Speed/High Frequency Applications
Organization:
IPC - Association Connecting Electronics Industries
Year: 2011
Abstract: This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness defined in the specification sheets as measured over the dielectric only. As a general guideline, laminates controlled by this specification usually have a dissipation factor of less than 0.005.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:49:57Z | |
| date available | 2017-09-04T16:49:57Z | |
| date copyright | 40878 | |
| date issued | 2011 | |
| identifier other | WMRCTEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/113542 | |
| description abstract | This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness defined in the specification sheets as measured over the dielectric only. As a general guideline, laminates controlled by this specification usually have a dissipation factor of less than 0.005. | |
| language | English | |
| title | IPC 4103A | num |
| title | Specification for Base Materials for High Speed/High Frequency Applications | en |
| type | standard | |
| page | 68 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2011 | |
| contenttype | fulltext |