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IPC TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 1988
Abstract: Objective
The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives:
• Evaluate the performance of small diameter PTHs under controlled environmental conditlons.
• Evaluate the influence of the thickness and quality of deposited copper on PTH performance.
• Determlne the impact of varying PTH aspect ratios.
• Collect data on the influence of product design or manufacturing methods.
• Determine if test results from different military and industrial thermal cycle and/or thermal shock procedures can be correlated.
The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives:
• Evaluate the performance of small diameter PTHs under controlled environmental conditlons.
• Evaluate the influence of the thickness and quality of deposited copper on PTH performance.
• Determlne the impact of varying PTH aspect ratios.
• Collect data on the influence of product design or manufacturing methods.
• Determine if test results from different military and industrial thermal cycle and/or thermal shock procedures can be correlated.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:18:03Z | |
| date available | 2017-09-04T17:18:03Z | |
| date copyright | 09/01/1988 | |
| date issued | 1988 | |
| identifier other | ZJWXCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/141404 | |
| description abstract | Objective The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives: • Evaluate the performance of small diameter PTHs under controlled environmental conditlons. • Evaluate the influence of the thickness and quality of deposited copper on PTH performance. • Determlne the impact of varying PTH aspect ratios. • Collect data on the influence of product design or manufacturing methods. • Determine if test results from different military and industrial thermal cycle and/or thermal shock procedures can be correlated. | |
| language | English | |
| title | IPC TR-579 | num |
| title | Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards | en |
| type | standard | |
| page | 90 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1988 | |
| contenttype | fulltext |