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IPC 4563
Resin Coated Copper Foil for Printed Boards Guideline
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:42:36Z | |
| date available | 2017-09-04T17:42:36Z | |
| date copyright | 39387 | |
| date issued | 2007 | |
| identifier other | EBIKCCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/165695 | |
| description abstract | This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. | |
| language | English | |
| title | IPC 4563 | num |
| title | Resin Coated Copper Foil for Printed Boards Guideline | en |
| type | standard | |
| page | 28 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |