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IPC TM-650 2.4.9.1
Peel Strength of Flexible Circuits
Organization:
IPC - Association Connecting Electronics Industries
Year: 1998
Abstract: The purpose of this test is to characterize peel adhesion at ambient conditions.
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IPC TM-650 2.4.9.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:47:49Z | |
| date available | 2017-09-04T17:47:49Z | |
| date copyright | 36100 | |
| date issued | 1998 | |
| identifier other | EPRXHAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/171063 | |
| description abstract | The purpose of this test is to characterize peel adhesion at ambient conditions. | |
| language | English | |
| title | IPC TM-650 2.4.9.1 | num |
| title | Peel Strength of Flexible Circuits | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |