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IPC TM-650 2.4.22.1C
Bow and Twist - Laminate
Organization:
IPC - Association Connecting Electronics Industries
Year: 1993
Abstract: This method covers the measurement of bow and twist by maximum vertical displacement of an unrestrained panel of either cut to size panels or finished rigid printed boards including single- and double-sided, multilayer, and the rigid segments of rigid flex printed circuits. This test method is only applicable to laminates greater than or equal to 0.5 mm [0.020 in] in thickness. This test method can also be used after etching or after thermal stress with requirements as agreed between user and vendor.
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IPC TM-650 2.4.22.1C
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:09:34Z | |
| date available | 2017-09-04T18:09:34Z | |
| date copyright | 05/01/1993 | |
| date issued | 1993 | |
| identifier other | GVAVNAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/192645 | |
| description abstract | This method covers the measurement of bow and twist by maximum vertical displacement of an unrestrained panel of either cut to size panels or finished rigid printed boards including single- and double-sided, multilayer, and the rigid segments of rigid flex printed circuits. This test method is only applicable to laminates greater than or equal to 0.5 mm [0.020 in] in thickness. This test method can also be used after etching or after thermal stress with requirements as agreed between user and vendor. | |
| language | English | |
| title | IPC TM-650 2.4.22.1C | num |
| title | Bow and Twist - Laminate | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1993 | |
| contenttype | fulltext |