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IPC 7095C
Design and Assembly Process Implementation for BGAs
Organization:
IPC - Association Connecting Electronics Industries
Year: 2013
Abstract: This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is addressed, as is the move to lead-free assembly processes. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs. Throughout this document the word ‘‘BGA'' can mean all types and forms of ball/column/bump/pillar grid array packages.
Purpose
The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic assembly, inspection, and repair processes. The purpose is to provide useful and practical information to those who are using BGAs, those who are considering BGA implementation and companies who are in the process of transition from standard tin/lead reflow processes to those that use lead-free materials
Purpose
The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic assembly, inspection, and repair processes. The purpose is to provide useful and practical information to those who are using BGAs, those who are considering BGA implementation and companies who are in the process of transition from standard tin/lead reflow processes to those that use lead-free materials
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:23:55Z | |
| date available | 2017-09-04T16:23:55Z | |
| date copyright | 01/01/2013 | |
| date issued | 2013 | |
| identifier other | TTSQBFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/87216 | |
| description abstract | This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is addressed, as is the move to lead-free assembly processes. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs. Throughout this document the word ‘‘BGA'' can mean all types and forms of ball/column/bump/pillar grid array packages. Purpose The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic assembly, inspection, and repair processes. The purpose is to provide useful and practical information to those who are using BGAs, those who are considering BGA implementation and companies who are in the process of transition from standard tin/lead reflow processes to those that use lead-free materials | |
| language | English | |
| title | IPC 7095C | num |
| title | Design and Assembly Process Implementation for BGAs | en |
| type | standard | |
| page | 176 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2013 | |
| contenttype | fulltext |