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IPC 7525B
Stencil Design Guidelines
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:33:22Z | |
| date available | 2017-09-04T16:33:22Z | |
| date copyright | 40817 | |
| date issued | 2011 | |
| identifier other | UUEEOEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/96808 | |
| description abstract | PURPOSE This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established. | |
| language | English | |
| title | IPC 7525B | num |
| title | Stencil Design Guidelines | en |
| type | standard | |
| page | 36 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2011 | |
| contenttype | fulltext |
