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IPC 7525B
Stencil Design Guidelines
Organization:
IPC - Association Connecting Electronics Industries
Year: 2011
Abstract: PURPOSE
This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established.
This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:33:22Z | |
| date available | 2017-09-04T16:33:22Z | |
| date copyright | 40817 | |
| date issued | 2011 | |
| identifier other | UUEEOEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/96808 | |
| description abstract | PURPOSE This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established. | |
| language | English | |
| title | IPC 7525B | num |
| title | Stencil Design Guidelines | en |
| type | standard | |
| page | 36 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2011 | |
| contenttype | fulltext |