درباره ما
IPC TM-650 2.4.40
Inner Layer Bond Strength of Multilayer Printed Circuit Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 1987
Abstract: This method is used to determine the inner layer bond strength of either a metal conductor or an individual dielectric.
Collections
:
-
Statistics
IPC TM-650 2.4.40
Show full item record
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:34:28Z | |
| date available | 2017-09-04T16:34:28Z | |
| date copyright | 32051 | |
| date issued | 1987 | |
| identifier other | UXJNCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/97972 | |
| description abstract | This method is used to determine the inner layer bond strength of either a metal conductor or an individual dielectric. | |
| language | English | |
| title | IPC TM-650 2.4.40 | num |
| title | Inner Layer Bond Strength of Multilayer Printed Circuit Boards | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |