IPC 2224

Abstract

This standard establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials: the interconnections may be single, double, or multilayered.<br><strong>Purpose</strong><br>The requirements contained herein are intended to establish design principles and recommendations that <strong>shall</strong> be used in conjunction with PC-2221 (see 1.2) to produce detailed designs intended to mount and attach passive and active components.<br>The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die. The materials may be any combination able to perform the physical, thermal, environmental, and electronic functions.<br><strong>Documentation Hierarchy</strong><br>Document hierarchy <strong>shall</strong> be in accordance with the generic standard IPC-2221.<br><strong>Presentation</strong><br>Presentation <strong>shall</strong> be in accordance with the generic standard IPC-2221.<br><strong>Interpretation</strong><br>Interpretation <strong>shall</strong> be in accordance with the generic standard IPC-2221.<br><strong>Classification of Products</strong><br>Classification of Products <strong>shall</strong> be in accordance with the generic standard IPC-2221 and as follows:<br><strong>Board Types</strong> <br>Board types are classified as:<br>Type 1 - Single-sided printed board<br>Type 2 - Double-sided printed board<br>Type 3 - Multilayer board without blind or buried vias<br>Type 4 - Multilayer board with blind and/or buried bias<br>Type 5 - Multilayer metal core board without blind or buried vias <br>Type 6 - Multilayer metal core board with blind and/or buried vias