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IPC SM-785
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
Organization:
IPC - Association Connecting Electronics Industries
Year: 1992
Abstract: This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. Background and design information is provided for an understanding of the accelerated test issues.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:34:49Z | |
| date available | 2017-09-04T16:34:49Z | |
| date copyright | 33909 | |
| date issued | 1992 | |
| identifier other | UYMZCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/98363 | |
| description abstract | This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. Background and design information is provided for an understanding of the accelerated test issues. | |
| language | English | |
| title | IPC SM-785 | num |
| title | Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments | en |
| type | standard | |
| page | 58 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1992 | |
| contenttype | fulltext |