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IPC TM-650 2.4.28.1F
Solder Mask Adhesion - Tape Test Method
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and after soldering), nonmelting metals, and printed board substrates.
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IPC TM-650 2.4.28.1F
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:35:55Z | |
| date available | 2017-09-04T16:35:55Z | |
| date copyright | 03/01/2007 | |
| date issued | 2007 | |
| identifier other | VBHVACAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/99376 | |
| description abstract | This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and after soldering), nonmelting metals, and printed board substrates. | |
| language | English | |
| title | IPC TM-650 2.4.28.1F | num |
| title | Solder Mask Adhesion - Tape Test Method | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |