JEDEC JESD51-5

Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T15:20:14Z
date available	2017-09-04T15:20:14Z
date copyright	02/01/1999
date issued	1999
identifier other	MVTXHAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/20134
description abstract	This extension of the thermal standards provides a standard fixture for direct attach type packages such as deep-downset of thermally tabbed packages. This specification provides additional design detail for use in developing thermal test boards with application to these package types. This document is in addition to and not replacement for the design specifications in other standards.
language	English
title	JEDEC JESD51-5	num
title	Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms	en
type	standard
page	9
status	Active
tree	JEDEC - Solid State Technology Association:;1999
contenttype	fulltext
subject keywords	Direct Attach Type Packages
subject keywords	Thermal Test
subject keywords	Thermally Tabbed Packages