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JEDEC JESD51-5
Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
Organization:
JEDEC - Solid State Technology Association
Year: 1999
Abstract: This extension of the thermal standards provides a standard fixture for direct attach type packages such as deep-downset of thermally tabbed packages. This specification provides additional design detail for use in developing thermal test boards with application to these package types. This document is in addition to and not replacement for the design specifications in other standards.
Subject: Direct Attach Type Packages
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:20:14Z | |
| date available | 2017-09-04T15:20:14Z | |
| date copyright | 02/01/1999 | |
| date issued | 1999 | |
| identifier other | MVTXHAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/20134 | |
| description abstract | This extension of the thermal standards provides a standard fixture for direct attach type packages such as deep-downset of thermally tabbed packages. This specification provides additional design detail for use in developing thermal test boards with application to these package types. This document is in addition to and not replacement for the design specifications in other standards. | |
| language | English | |
| title | JEDEC JESD51-5 | num |
| title | Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms | en |
| type | standard | |
| page | 9 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;1999 | |
| contenttype | fulltext | |
| subject keywords | Direct Attach Type Packages | |
| subject keywords | Thermal Test | |
| subject keywords | Thermally Tabbed Packages |