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JEDEC JESD22-B111

Board Level Drop Test Method of Components for Handheld Electronic Products

Organization:
JEDEC - Solid State Technology Association
Year: 2003

Abstract: This Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.
URI: http://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/40053
Subject: Drop Test
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contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T15:38:02Z
date available2017-09-04T15:38:02Z
date copyright07/01/2003
date issued2003
identifier otherOWXPJBAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/40053
description abstractThis Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.
languageEnglish
titleJEDEC JESD22-B111num
titleBoard Level Drop Test Method of Components for Handheld Electronic Productsen
typestandard
page22
statusActive
treeJEDEC - Solid State Technology Association:;2003
contenttypefulltext
subject keywordsDrop Test
subject keywordsHandheld Products
subject keywordsTest Method - Board Level Drop Test
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