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JEDEC JESD75-1

Ball Grid Array Pinouts Standardized for 16, 18 and 20-Bit Logic Functions Using a 54 Ball Package

Organization:
JEDEC - Solid State Technology Association
Year: 2001

Abstract: This standard establishes a 54 Ball Grid Array pinout for 16, 18 and 20-bit standard logic devices that are currently being produced in 48 and 56 Pin SSOP and TSSOP packages. The 54 Ball Grid Array Package is organized as a 6 x 9 array with balls on a .8mm x .8mm grid pitch.
URI: http://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/42905
Subject: 54 Ball Package
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  • JEDEC - Solid State Technology Association
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    JEDEC JESD75-1

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contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T15:40:42Z
date available2017-09-04T15:40:42Z
date copyright37165
date issued2001
identifier otherPEOCTAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/42905
description abstractThis standard establishes a 54 Ball Grid Array pinout for 16, 18 and 20-bit standard logic devices that are currently being produced in 48 and 56 Pin SSOP and TSSOP packages. The 54 Ball Grid Array Package is organized as a 6 x 9 array with balls on a .8mm x .8mm grid pitch.
languageEnglish
titleJEDEC JESD75-1num
titleBall Grid Array Pinouts Standardized for 16, 18 and 20-Bit Logic Functions Using a 54 Ball Packageen
typestandard
page10
statusActive
treeJEDEC - Solid State Technology Association:;2001
contenttypefulltext
subject keywords54 Ball Package
subject keywordsBall Grid Array
subject keywordsBGA
subject keywordsLogic Functions
subject keywordsPinouts
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