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JEDEC JESD51-12
Guidelines for Reporting and Using Electronic Package Thermal Information
Organization:
JEDEC - Solid State Technology Association
Year: 2005
Abstract: This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users.
Subject: Electronic Package
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JEDEC JESD51-12
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:48:28Z | |
| date available | 2017-09-04T15:48:28Z | |
| date copyright | 05/01/2005 | |
| date issued | 2005 | |
| identifier other | QBGDKBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/51409 | |
| description abstract | This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users. | |
| language | English | |
| title | JEDEC JESD51-12 | num |
| title | Guidelines for Reporting and Using Electronic Package Thermal Information | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2005 | |
| contenttype | fulltext | |
| subject keywords | Electronic Package | |
| subject keywords | Reporting | |
| subject keywords | Thermal |