JEDEC JESD22-B105D

Abstract

This test method provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly. For hermetic packages, it is recommended that this test be followed by hermeticity tests in accordance with JESD22A109 (Test Method A109) to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. These tests, including each of its test conditions, are considered destructive and are only recommended for qualification testing. This test is applicable to all through-hole devices and surface-mount devices requiring lead forming by the user. The following is a summary of the test conditions in this standard; <br><strong>a) Test Condition A Tension</strong> <br>This test condition provides for the application of straight tensile loading. See clause 6. <br><strong>b) Test Condition B - Bending Stress</strong> <br>This test condition provides for the application of bending stresses to determine the integrity of leads, seals and lead plating. See clause 7. <br><strong>c) Test Condition C - Lead Fatigue</strong> <br>This test condition provides for the application of bending stresses primarily to determine the resistance of the leads to metal fatigue under repeated bending. See clause 8. <br><strong>d) Test Condition D - Lead Torque</strong> <br>This test condition provides for the application of stresses to the leads to determine the resistance of seals and leads to twisting motions. See clause 9. <br><strong>e) Test Condition E - Stud Torque</strong> <br>This test condition provides for the application of stresses on a threaded mounting stud caused by tightening the device during mounting. See clause 10.