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ECA EIA-540AD00
Blank Detail Specification for Adaptor - Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment
Organization:
ECIA - Electronic Components Industry Association
Year: 1997
Abstract: The Quad Flatpack Carrier of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure dimensions (See Figure 1).
b) Working voltage not to exceed - voits (rrns).
e) Current not to exceed - amperes per pin or semiconductor package manufacturer's recommendations
OBJECT
The object of this Detail Specification is to provide all information required, using Sectional Specification EIA-540A000 as a base, for the identification and quality assessment of Quad Flatpack Carrier for surface mount devices having-or-lead spacing, interfacing to pin grid anay sockets on 2.54 mm X 2.54 mm (.100 in. X .100 in.) pitch. The information contained herein or by reference is complete and sufficient for inspection purposes. This device is designed to be used with EIA-540 documents, EIA-540BAAA, EIA-540BAAB, EIA-540BACC and EIA-540BAAD.
a) Maximum enclosure dimensions (See Figure 1).
b) Working voltage not to exceed - voits (rrns).
e) Current not to exceed - amperes per pin or semiconductor package manufacturer's recommendations
OBJECT
The object of this Detail Specification is to provide all information required, using Sectional Specification EIA-540A000 as a base, for the identification and quality assessment of Quad Flatpack Carrier for surface mount devices having-or-lead spacing, interfacing to pin grid anay sockets on 2.54 mm X 2.54 mm (.100 in. X .100 in.) pitch. The information contained herein or by reference is complete and sufficient for inspection purposes. This device is designed to be used with EIA-540 documents, EIA-540BAAA, EIA-540BAAB, EIA-540BACC and EIA-540BAAD.
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ECA EIA-540AD00
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T17:58:06Z | |
| date available | 2017-09-04T17:58:06Z | |
| date copyright | 10/01/1991 (R 1997) | |
| date issued | 1997 | |
| identifier other | FQQRCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho462sear3FCDCAC4/handle/yse/181204 | |
| description abstract | The Quad Flatpack Carrier of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions (See Figure 1). b) Working voltage not to exceed - voits (rrns). e) Current not to exceed - amperes per pin or semiconductor package manufacturer's recommendations OBJECT The object of this Detail Specification is to provide all information required, using Sectional Specification EIA-540A000 as a base, for the identification and quality assessment of Quad Flatpack Carrier for surface mount devices having-or-lead spacing, interfacing to pin grid anay sockets on 2.54 mm X 2.54 mm (.100 in. X .100 in.) pitch. The information contained herein or by reference is complete and sufficient for inspection purposes. This device is designed to be used with EIA-540 documents, EIA-540BAAA, EIA-540BAAB, EIA-540BACC and EIA-540BAAD. | |
| language | English | |
| title | ECA EIA-540AD00 | num |
| title | Blank Detail Specification for Adaptor - Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment | en |
| type | standard | |
| page | 16 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1997 | |
| contenttype | fulltext |