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MIL-PRF-55681F

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

Organization:
ARMY - CR - US Army Communications Electronics Command
Year: 2004

Abstract: This specification covers the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors. ER capacitors covered by this specification have failure rate levels (FRL) ranging from 1.0 percent to 0.001 percent per 1,000 hours. These FRLs are established at a 90-percent confidence level and maintained at a 10-percent producer's risk and are based on life tests performed at maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. Intended Use: Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in capacitance with respect to temperature (−55°C to +125°C), voltage, frequency, and life can be tolerated. This specification also covers high frequency capacitors (CDR11 through CDR14 and CDR21 through CDR25) that are primarily intended for use in resonant circuits with high Q factor and stability of capacitance with respect to temperature (−55°C to +125°C), frequency, and life. These capacitors also offer established reliability that is verified under a qualification system. Commercial components are not designed to withstand these military environmental conditions.
URI: http://yse.yabesh.ir/std;query=autho47037D83FCDC49A/handle/yse/82321
Subject: Part per million (ppm)
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    MIL-PRF-55681F

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contributor authorARMY - CR - US Army Communications Electronics Command
date accessioned2017-09-04T16:18:52Z
date available2017-09-04T16:18:52Z
date copyright09/03/2004
date issued2004
identifier otherTGQZFBAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho47037D83FCDC49A/handle/yse/82321
description abstractThis specification covers the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors. ER capacitors covered by this specification have failure rate levels (FRL) ranging from 1.0 percent to 0.001 percent per 1,000 hours. These FRLs are established at a 90-percent confidence level and maintained at a 10-percent producer's risk and are based on life tests performed at maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. Intended Use: Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in capacitance with respect to temperature (−55°C to +125°C), voltage, frequency, and life can be tolerated. This specification also covers high frequency capacitors (CDR11 through CDR14 and CDR21 through CDR25) that are primarily intended for use in resonant circuits with high Q factor and stability of capacitance with respect to temperature (−55°C to +125°C), frequency, and life. These capacitors also offer established reliability that is verified under a qualification system. Commercial components are not designed to withstand these military environmental conditions.
languageEnglish
titleMIL-PRF-55681Fnum
titleCAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FORen
typestandard
page40
statusActive
treeARMY - CR - US Army Communications Electronics Command:;2004
contenttypefulltext
subject keywordsPart per million (ppm)
subject keywordsStatistical process control (SPC)
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