درباره ما
TIA TIA-455-188
FOTP-188 Low Temperature Testing of Fiber Optic Components
| contributor author | TIA - Telecommunications Industry Association | |
| date accessioned | 2017-09-04T17:54:31Z | |
| date available | 2017-09-04T17:54:31Z | |
| date copyright | 12/09/1991 (R 2008) | |
| date issued | 2008 | |
| identifier other | FHHYKCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho47037D83FCDC49A961598F1EFDEC9FCD/handle/yse/177611 | |
| description abstract | Intent This procedure is intended for exposing a specimen to the environmental condition of extended low temperature (cold). It is not intended for exposing a specimen to the environmental condition of high temperature or of temperature variation. When high temperature is of interest, use FOTP-4. When temperature variations are of interest, use FOTP-3. | |
| language | English | |
| title | TIA TIA-455-188 | num |
| title | FOTP-188 Low Temperature Testing of Fiber Optic Components | en |
| type | standard | |
| page | 14 | |
| status | Active | |
| tree | TIA - Telecommunications Industry Association:;2008 | |
| contenttype | fulltext |
