TIA TIA-455-188
FOTP-188 Low Temperature Testing of Fiber Optic Components
Organization:
TIA - Telecommunications Industry Association
Year: 2008
Abstract: Intent
This procedure is intended for exposing a specimen to the environmental condition of extended low temperature (cold). It is not intended for exposing a specimen to the environmental condition of high temperature or of temperature variation. When high temperature is of interest, use FOTP-4. When temperature variations are of interest, use FOTP-3.
This procedure is intended for exposing a specimen to the environmental condition of extended low temperature (cold). It is not intended for exposing a specimen to the environmental condition of high temperature or of temperature variation. When high temperature is of interest, use FOTP-4. When temperature variations are of interest, use FOTP-3.
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TIA TIA-455-188
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contributor author | TIA - Telecommunications Industry Association | |
date accessioned | 2017-09-04T17:54:31Z | |
date available | 2017-09-04T17:54:31Z | |
date copyright | 12/09/1991 (R 2008) | |
date issued | 2008 | |
identifier other | FHHYKCAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;query=autho47037D83FCDC49A961598F1EFDEC9FCD/handle/yse/177611 | |
description abstract | Intent This procedure is intended for exposing a specimen to the environmental condition of extended low temperature (cold). It is not intended for exposing a specimen to the environmental condition of high temperature or of temperature variation. When high temperature is of interest, use FOTP-4. When temperature variations are of interest, use FOTP-3. | |
language | English | |
title | TIA TIA-455-188 | num |
title | FOTP-188 Low Temperature Testing of Fiber Optic Components | en |
type | standard | |
page | 14 | |
status | Active | |
tree | TIA - Telecommunications Industry Association:;2008 | |
contenttype | fulltext |