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ECA EIA/ECA-961
QUALIFICATION SPECIFICATION FOR DIE LEVEL NETWORKS WITH SOLDER BUMP INTERCONNECTS
Organization:
ECIA - Electronic Components Industry Association
Year: 2005
Abstract: Description
This specification defines the qualification program for Integrated Passive Devices (IPD) with die level solder bump interconnects. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the supplier of its responsibility to its own company's internal qualification and on-going certification program.
Preconditioning
This process is intended to simulate exposure to the thermal environment of the typical printed circuit board assembly process before any specific qualification testing is conducted. The recommended reflow process simulation for bonding IPD's with die level solder bump interconnects in the industry is described in appendix A.
This specification defines the qualification program for Integrated Passive Devices (IPD) with die level solder bump interconnects. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the supplier of its responsibility to its own company's internal qualification and on-going certification program.
Preconditioning
This process is intended to simulate exposure to the thermal environment of the typical printed circuit board assembly process before any specific qualification testing is conducted. The recommended reflow process simulation for bonding IPD's with die level solder bump interconnects in the industry is described in appendix A.
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ECA EIA/ECA-961
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:58:49Z | |
| date available | 2017-09-04T16:58:49Z | |
| date copyright | 38657 | |
| date issued | 2005 | |
| identifier other | XKGSIBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/122255 | |
| description abstract | Description This specification defines the qualification program for Integrated Passive Devices (IPD) with die level solder bump interconnects. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the supplier of its responsibility to its own company's internal qualification and on-going certification program. Preconditioning This process is intended to simulate exposure to the thermal environment of the typical printed circuit board assembly process before any specific qualification testing is conducted. The recommended reflow process simulation for bonding IPD's with die level solder bump interconnects in the industry is described in appendix A. | |
| language | English | |
| title | ECA EIA/ECA-961 | num |
| title | QUALIFICATION SPECIFICATION FOR DIE LEVEL NETWORKS WITH SOLDER BUMP INTERCONNECTS | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2005 | |
| contenttype | fulltext |