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X-Ray Fluorescence for Measuring Plating Thickness

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T17:02:42Z
date available2017-09-04T17:02:42Z
date copyright01/01/1990
date issued1990
identifier otherXUWFCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/126200
description abstractPURPOSE
There are a number of techniques currently being used for measuring plating thickness. All have peculiar application and also limitations, Basic economics, however, demands that for measuring gold thicknesses in the commonly used plating thickness ranges, a system must be highly reliable, accurate, repeatable and fast. Over the past several years X-ray Fiuorescence systems, more than any other, have been found to meet that requirement. There are, however, many facets of operation involved with x-ray techniques with which the operator should be acquainted. The purpose of this paper is to highlight these subtleties so that x-ray users are aware of them and can implement procedures for their instrument operation which will provide measurements of highest possible levels of accuracy and repeatability.
languageEnglish
titleECA CB-13num
titleX-Ray Fluorescence for Measuring Plating Thicknessen
typestandard
page8
statusActive
treeECIA - Electronic Components Industry Association:;1990
contenttypefulltext


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