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ECA CB-13
X-Ray Fluorescence for Measuring Plating Thickness
Organization:
ECIA - Electronic Components Industry Association
Year: 1990
Abstract: PURPOSE
There are a number of techniques currently being used for measuring plating thickness. All have peculiar application and also limitations, Basic economics, however, demands that for measuring gold thicknesses in the commonly used plating thickness ranges, a system must be highly reliable, accurate, repeatable and fast. Over the past several years X-ray Fiuorescence systems, more than any other, have been found to meet that requirement. There are, however, many facets of operation involved with x-ray techniques with which the operator should be acquainted. The purpose of this paper is to highlight these subtleties so that x-ray users are aware of them and can implement procedures for their instrument operation which will provide measurements of highest possible levels of accuracy and repeatability.
There are a number of techniques currently being used for measuring plating thickness. All have peculiar application and also limitations, Basic economics, however, demands that for measuring gold thicknesses in the commonly used plating thickness ranges, a system must be highly reliable, accurate, repeatable and fast. Over the past several years X-ray Fiuorescence systems, more than any other, have been found to meet that requirement. There are, however, many facets of operation involved with x-ray techniques with which the operator should be acquainted. The purpose of this paper is to highlight these subtleties so that x-ray users are aware of them and can implement procedures for their instrument operation which will provide measurements of highest possible levels of accuracy and repeatability.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T17:02:42Z | |
| date available | 2017-09-04T17:02:42Z | |
| date copyright | 01/01/1990 | |
| date issued | 1990 | |
| identifier other | XUWFCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/126200 | |
| description abstract | PURPOSE There are a number of techniques currently being used for measuring plating thickness. All have peculiar application and also limitations, Basic economics, however, demands that for measuring gold thicknesses in the commonly used plating thickness ranges, a system must be highly reliable, accurate, repeatable and fast. Over the past several years X-ray Fiuorescence systems, more than any other, have been found to meet that requirement. There are, however, many facets of operation involved with x-ray techniques with which the operator should be acquainted. The purpose of this paper is to highlight these subtleties so that x-ray users are aware of them and can implement procedures for their instrument operation which will provide measurements of highest possible levels of accuracy and repeatability. | |
| language | English | |
| title | ECA CB-13 | num |
| title | X-Ray Fluorescence for Measuring Plating Thickness | en |
| type | standard | |
| page | 8 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1990 | |
| contenttype | fulltext |