ECA EIA-540FAAD

Detail Specification for Multi- Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment - Stabilized: May 2013

contributor author	ECIA - Electronic Components Industry Association
date accessioned	2017-09-04T17:21:48Z
date available	2017-09-04T17:21:48Z
date copyright	06/01/1992 (S 2013)
date issued	2013
identifier other	ZUEQGBAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho470393FD081D20686159DD6EFDEC9FCD0Facilities%20Engineering%20Command%226EFDEC9FCD/handle/yse/144999
description abstract	The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions (See Figure 1.) b) Working voltage not to exceed 250 volts (rms). c) Current not to exceed 1.0 amperes per pin. OBJECT The object of this Detail Specification is to provide all information required using Sectional Specification EIA-540F000 as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.
language	English
title	ECA EIA-540FAAD	num
title	Detail Specification for Multi- Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment - Stabilized: May 2013	en
type	standard
page	24
status	Active
tree	ECIA - Electronic Components Industry Association:;2013
contenttype	fulltext